Heating Buffer VPU 23
very small footprint
adjustable dwell time in the heating buffer
adjustable temperature
permanent control of the temperature
airflow is checked permanently
reduced power consumption compared to regular ovens
max. size of the board: 460 x 230 mm
Enhancing the durability and application areas (e.g. aerospace industry) of PCB boards through treatment with different lacquers is gaining more and more in importance. In order to reduce the drying time and therefore the overall cycle time of the products, it is necessary to heat the components after varnishing.
Rommel has developed a space-saving heating buffer (based on the existing buffer system VPR 23), which is able to store up to 10 boards for several minutes at a constant drying temperature of 60°C. Any fumes are absorbed while the airflow is checked permanently through a flow detector, which induces an alarm system in case of airflow problems. The adjacent system can then cool down the components to prepare them for any subsequent production processes.
